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Xilinx collaboration with TSMC process using 16FinFET listed together to create the highest
Date:2013-12-03
    Xilinx, Inc. (Xilinx, Inc (NASDAQ:. XLNX)) and TSMC Company (TWSE: 2330, NYSE: TSM) today jointly announced jointly promote a Xilinx called "FinFast" special schemes, TSMC's advanced 16- nanometer FinFET (16FinFET) process to create the listing has the fastest and highest performance advantages of FPGA devices. The two sides were put in the resources required to put together a dedicated team for FinFET technology and Xilinx UltraScale ™ architecture optimization. Based on this plan , 16FinFET test chip is expected to launch later in 2013 , while the first product in 2014 asked the city . In addition , the two companies are working together by means of TSMC 's CoWoS 3D IC manufacturing process in order to achieve the highest level of 3D IC system integration and system-level performance and related products bilateral cooperation in this field will be scheduled for later . Xilinx President and CEO Moshe Gavrielov said: "I am very convinced that Xilinx with TSMC 16 nanometer " Cooperation on FinFast " program will continue until the two sides in the results obtained by the advanced technology and leadership we are committed to cooperation and TSMC TSMC is because in technology, design and implementation , service and support for all aspects of quality and product delivery , are dedicated semiconductor foundry industry leader . " TSMC Dr. Morris Chang , chairman and CEO , said: " we work together with Xilinx , committed to the industry's highest performance , highest integration of programmable devices quickly into the market we will be working together in 2013 and 2014 respectively, has launched using . TSMC 20SoC 16FinFET process technology and world-class products . " TSMC recently announced the production process 16FinFET technology will advance to 2013 . Xilinx and TSMC partnership , in addition to fully benefit from the technology to speed up the production schedule , but also enjoy TSMC 16FinFET technology brings high performance and low power consumption advantages. Xilinx collaboration with TSMC , the demand for high-end FPGA will import FinFET development process , just as its practice in the 28HPL and 20SoC process development , both sides will further against TSMC's process technology , Xilinx the UltraScale architecture and a new generation of development tools, all optimized to achieve the best results of cooperation . ASIC is the latest stage UltraScale Xilinx architecture , from 20 nm to 16 nm planar technology and advanced technology FinFET extend the system can also be extended by a single chip 3D IC technology.

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